Intel Xeon X3450 BX80605X3450 Manual Do Utilizador
Códigos do produto
BX80605X3450
Electrical Specifications
74
Intel® Xeon® Processor 3400 Series Datasheet, Volume 1
Notes:
1.
Refer to the PCI Express Base Specification for more details.
2.
V
TX-AC-CM-PP
and V
TX-AC-CM-P
are defined in the PCI Express Base Specification. Measurement is made over at least 10^
6
UI.
3.
As measured with compliance test load. Defined as 2*|V
TXD+
– V
TXD-
|.
4.
COMP resistance must be provided on the system board with 1% resistors. COMP resistors are to V
SS
.
5.
PEG_ICOMPO, PEG_ICOMPI, PEG_RCOMPO are the same resistor
6.
RMS value.
7.
Measured at Rx pins into a pair of 50-Ω terminations into ground. Common mode peak voltage is defined by the expression:
max{|(Vd+ - Vd-) – V-CMDC|}.
8.
DC impedance limits are needed to guarantee Receiver detect.
9.
The Rx DC Common Mode Impedance must be present when the Receiver terminations are first enabled to ensure that the
Receiver Detect occurs properly. Compensation of this impedance can start immediately and the 15 Rx Common Mode
Impedance (constrained by RLRX-CM to 50Ω ±20%) must be within the specified range by the time Detect is entered.
10. Low impedance defined during signaling. Parameter is captured for 5.0 GHz by RLTX-DIFF.
7.10
Platform Environmental Control Interface (PECI)
DC Specifications
PECI is an Intel proprietary interface that provides a communication channel between
Intel processors and chipset components to external thermal monitoring devices. The
processor contains a Digital Thermal Sensor (DTS) that reports a relative die
temperature as an offset from Thermal Control Circuit (TCC) activation temperature.
Temperature sensors located throughout the die are implemented as analog-to-digital
converters calibrated at the factory. PECI provides an interface for external devices to
read the DTS temperature for thermal management and fan speed control. For the
PECI command set supported by the processor, refer to the appropriate processor
Thermal and Mechanical Specifications and Design Guidelines for additional information
(see
Intel processors and chipset components to external thermal monitoring devices. The
processor contains a Digital Thermal Sensor (DTS) that reports a relative die
temperature as an offset from Thermal Control Circuit (TCC) activation temperature.
Temperature sensors located throughout the die are implemented as analog-to-digital
converters calibrated at the factory. PECI provides an interface for external devices to
read the DTS temperature for thermal management and fan speed control. For the
PECI command set supported by the processor, refer to the appropriate processor
Thermal and Mechanical Specifications and Design Guidelines for additional information
(see
).
Table 7-10. PCI Express DC Specifications
Symbol
Alpha
Group
Parameter
Min
Typ
Max
Units
Notes
1
V
TX-DIFF-p-p
(ad)
Differential peak to peak Tx voltage swing
0.8
—
1.2
V
3
V
TX_CM-AC-p
(ad)
Tx AC Peak Common Mode Output Voltage
(Gen1 only)
—
—
20
mV
1,2,6
V
TX_CM-AC-p-p
(ad)
Tx AC Peak-to-Peak Common Mode Output
Voltage (Gen2 only)
—
—
100
mV
1,2
Z
TX-DIFF-DC
(ad)
DC Differential Tx Impedance (Gen1 only)
80
—
120
Ω
1,10
Z
TX-DIFF-DC
(ad)
DC Differential Tx Impedance (Gen2 only)
—
—
120
Ω
1,10
Z
RX-DC
(ac)
DC Common Mode Rx Impedance
40
—
60
Ω
1,8,9
Z
RX-DIFF-DC
(ac)
DC Differential Rx Impedance (Gen1 only)
80
—
120
Ω
1
V
RX-DIFFp-p
(ac)
Differential Rx input Peak to Peak Voltage
(Gen1 only)
0.175
—
1.2
V
1
V
RX-DIFFp-p
(ac)
Differential Rx Input Peak to Peak Voltage
(Gen2 only)
0.120
—
1.2
V
1,1
V
RX_CM-AC-p
(ac)
Rx AC peak Common Mode Input Voltage
—
—
150
mV
1,7
PEG_ICOMPO
(ae)
Comp Resistance
49.5
50
50.5
Ω
4,5
PEG_ICOMPI
(ae)
Comp Resistance
49.5
50
50.5
Ω
4,5
PEG_RCOMPO
(ae)
Comp Resistance
49.5
50
50.5
Ω
4,5
PEG_RBIAS
(ae)
Comp Resistance
742.5
750
757.5
Ω
4,5