Ficha De Dados (LE80557RE009512)índice analíticoIntel® Celeron® Processor 200D Sequence1Contents3Figures4Tables4Revision History5Intel® Celeron® Processor 200 Sequence Features71 Introduction91.1 Terminology91.1.1 Processor Packaging Terminology101.2 References112 Low Power Features132.1 Power-On Configuration Options132.2 Clock Control and Low Power States132.2.1 Normal State142.2.1.1 HALT Powerdown State142.2.2 Stop Grant State152.2.3 HALT Snoop State and Stop Grant Snoop State153 Electrical Specifications173.1 Power and Ground Pins173.2 Decoupling Guidelines173.2.1 VCC Decoupling173.2.2 VCCP Decoupling173.2.3 FSB Decoupling183.3 Voltage Identification183.4 Catastrophic Thermal Protection223.5 Reserved and Unused Pins223.6 FSB Frequency Select Signals (BSEL[2:0])223.7 Voltage and Current Specification233.7.1 Absolute Maximum and Minimum Ratings233.7.2 DC Voltage and Current Specification243.7.3 VCC Overshoot263.7.4 Die Voltage Validation273.8 Signaling Specifications273.8.1 FSB Signal Groups273.8.2 CMOS and Open Drain Signals293.8.3 Processor DC Specifications303.8.3.1 GTL+ Front Side Bus Specifications313.9 Clock Specifications323.9.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking324 Package Mechanical Specifications and Pin Information334.1 Package Mechanical Specifications334.1.1 Processor Component Keep-Out Zones334.1.2 Package Loading Specifications334.1.3 Processor Mass Specifications344.1.4 Processor Markings374.2 Processor Pinout and Pin List374.3 Alphabetical Signals Reference525 Thermal Specifications615.1 Thermal Specifications615.2 Processor Thermal Features625.2.1 Thermal Monitor625.2.2 On-Demand Mode625.2.3 PROCHOT# Signal635.2.4 THERMTRIP# Signal635.3 Processor Thermal Features635.4 Intel® Thermal Monitor645.5 Digital Thermal Sensor65Tamanho: 500 KBPáginas: 66Language: EnglishAbrir o manual
