Справочник Пользователя для Intel E8500

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Intel has developed one different reference thermal solution designed to meet the cooling needs of 
the E8500 chipset XMB component under operating environments and specifications defined in 
this document. This chapter describes the overall requirements for the XMB reference thermal 
solution including critical-to-function dimensions, operating environment, and validation criteria. 
Other chipset components may or may not need attached thermal solutions, depending on your 
specific system local-ambient operating conditions. For information on the Intel

®

 6700PXH 64-bit 

PCI Hub, refer to thermal specification in the Intel

Thermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in 
the Intel

The reference thermal solution was designed assuming a maximum local-ambient temperature of 
57°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is 
300 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the 
local-ambient temperature. The thermal designer must carefully select the location to measure 
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C 
external-ambient temperature at sea level. (External-ambient refers to the environment external to 
the system.)

The fasteners associated for this reference thermal solution is intended to be used on 0.062” 
thickness motherboard.

 depicts the measured thermal performance of the XMB reference thermal solution 

versus approach air velocity. Since this data was measured at sea level, a correction factor would be 
required to estimate thermal performance at other altitudes.

2.5

3

3.5

4

4.5

5

5.5

0

100

200

300

400

500

600

Flow Rate (LFM)

Ȍ

ca

 (

°C

/W

)