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Intel
®
E8500 Chipset North Bridge (NB) and eXternal Memory
39
Bridge (XMB) Thermal/Mechanical Design Guide
XMB Reference Thermal Solution
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in
contains vendor information for each thermal solution component.
8.5.1
Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.
with the direction of the heatsink fins.
Figure 8-3. XMB Heatsink Board Component Keepout
XMB Location
No Component Keep Out Area
2.48mm Max Component Height
Heatsink Mounting Hole
38.097mm. 48.260mm.
37.500mm.
55.250mm.
63.500mm.
4X Ø 5.5mm
4X Ø 2.95 ± 0.0254mm
37.5mm
Figure 8-4. XMB Heatsink Assembly