Справочник Пользователя для Intel E8500

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While each design may have unique mechanical volume and height restrictions or implementation 
requirements, the height, width and depth constraints typically placed on the E8500 chipset XMB 
thermal solution are showing in 

When using heatsinks that extend beyond the XMB reference heatsink envelope shown in 

, any motherboard components placed between the heatsink and motherboard cannot 

exceed 2.48 mm (0.10 in.) in height.

The locations of holes pattern and keepout zones for the reference thermal solution are shown in 

The reference thermal solution for the chipset XMB component is a passive extruded heatsink with 
thermal interface. It is attached to the board by using four retaining Tuflok fasteners. 

shows the reference thermal solution assembly and associated components.

Heatsink Fin

48.

26

 m

m

.

63.50mm.

45.50mm.

Heatsink Base

26

.6

0 m

m

.

Motherboard

Heatsink Fin

4.

5 m

m

.

2.

60

 m

m

.

30

.2

6

 m

m

.