用户手册 — Intel Core 2 Extreme QX6850

目录

• Contents

  3
  • Figures

    5
  • Tables

    6
• Revision History

  7
• Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Sequence Features

  9
• Intel® Core™2 Extreme Processor X6800D and Intel® Core™2 Duo Desktop Processor E6000D and E4000D Sequences

  1
• 1 Introduction

  11
  • 1.1 Terminology

    12
    • 1.1.1 Processor Terminology

      12
  • 1.2 References

    14
    • Table 1. Reference Documents

      14
• 2 Electrical Specifications

  15
  • 2.1 Power and Ground Lands

    15
  • 2.2 Decoupling Guidelines

    15
    • 2.2.1 VCC Decoupling

      15
    • 2.2.2 Vtt Decoupling

      15
    • 2.2.3 FSB Decoupling

      16
  • 2.3 Voltage Identification

    16
    • Table 2. Voltage Identification Definition

      17
  • 2.4 Market Segment Identification (MSID)

    18
    • Table 3. Market Segment Selection Truth Table for MSID[1:0], , ,

      18
  • 2.5 Reserved, Unused, and TESTHI Signals

    18
  • 2.6 Voltage and Current Specification

    19
    • 2.6.1 Absolute Maximum and Minimum Ratings

      19
      • Table 4. Absolute Maximum and Minimum Ratings

        20
    • 2.6.2 DC Voltage and Current Specification

      20
      • Table 5. Voltage and Current Specifications

        20
      • Table 6. VCC Static and Transient Tolerance for Processors with 4 MB L2 Cache

        22
      • Figure 1. VCC Static and Transient Tolerance for Processors with 4 MB L2 Cache

        23
      • Table 7. VCC Static and Transient Tolerance for Processors with 2 MB L2 Cache

        24
      • Figure 2. VCC Static and Transient Tolerance for Processors with 2 MB L2 Cache

        25
    • 2.6.3 VCC Overshoot

      25
      • Table 8. VCC Overshoot Specifications

        25
      • Figure 3. VCC Overshoot Example Waveform

        26
    • 2.6.4 Die Voltage Validation

      26
  • 2.7 Signaling Specifications

    26
    • 2.7.1 FSB Signal Groups

      27
      • Table 9. FSB Signal Groups

        27
      • Table 10. Signal Characteristics

        28
      • Table 11. Signal Reference Voltages

        28
    • 2.7.2 CMOS and Open Drain Signals

      28
    • 2.7.3 Processor DC Specifications

      29
      • Table 12. GTL+ Signal Group DC Specifications

        29
      • Table 13. Open Drain and TAP Output Signal Group DC Specifications

        29
      • Table 14. CMOS Signal Group DC Specifications

        30
      • 2.7.3.1 GTL+ Front Side Bus Specifications

        30
        • Table 15. GTL+ Bus Voltage Definitions

          30
    • 2.7.4 Clock Specifications

      31
    • 2.7.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking

      31
      • Table 16. Core Frequency to FSB Multiplier Configuration

        31
    • 2.7.6 FSB Frequency Select Signals (BSEL[2:0])

      31
      • Table 17. BSEL[2:0] Frequency Table for BCLK[1:0]

        32
    • 2.7.7 Phase Lock Loop (PLL) and Filter

      32
    • 2.7.8 BCLK[1:0] Specifications (CK505 based Platforms)

      32
      • Table 18. Front Side Bus Differential BCLK Specifications

        32
      • Figure 4. Differential Clock Waveform

        33
      • Figure 5. Differential Clock Crosspoint Specification

        33
      • Figure 6. Differential Measurements

        33
    • 2.7.9 BCLK[1:0] Specifications (CK410 based Platforms)

      34
      • Table 19. Front Side Bus Differential BCLK Specifications

        34
      • Figure 7. Differential Clock Crosspoint Specification

        34
  • 2.8 PECI DC Specifications

    35
    • Table 20. PECI DC Electrical Limits

      35
• 3 Package Mechanical Specifications

  37
  • Figure 8. Processor Package Assembly Sketch

    37
  • 3.1 Package Mechanical Drawing

    37
    • Figure 9. Processor Package Drawing Sheet 1 of 3

      38
    • Figure 10. Processor Package Drawing Sheet 2 of 3

      39
    • Figure 11. Processor Package Drawing Sheet 3 of 3

      40
    • 3.1.1 Processor Component Keep-Out Zones

      41
    • 3.1.2 Package Loading Specifications

      41
      • Table 21. Processor Loading Specifications

        41
    • 3.1.3 Package Handling Guidelines

      41
      • Table 22. Package Handling Guidelines

        41
    • 3.1.4 Package Insertion Specifications

      42
    • 3.1.5 Processor Mass Specification

      42
    • 3.1.6 Processor Materials

      42
      • Table 23. Processor Materials

        42
    • 3.1.7 Processor Markings

      42
      • Figure 12. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processor E6000 Sequence with 4 MB L2 Cache with 1333 MHz FSB

        42
      • Figure 13. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Sequence with 4 MB L2 Cache with 1066 MHz FSB

        43
      • Figure 14. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Sequence with 2 MB L2 Cache

        43
      • Figure 15. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E4000 Sequence with 2 MB L2 Cache

        44
      • Figure 16. Processor Top-Side Markings for the Intel® Core™2 Extreme Processor X6800

        44
    • 3.1.8 Processor Land Coordinates

      45
      • Figure 17. Processor Land Coordinates and Quadrants (Top View)

        45
• 4 Land Listing and Signal Descriptions

  47
  • 4.1 Processor Land Assignments

    47
    • Figure 18. land-out Diagram (Top View - Left Side)

      48
    • Figure 19. land-out Diagram (Top View - Right Side)

      49
    • Table 24. Alphabetical Land Assignments

      50
    • Table 25. Numerical Land Assignment

      60
  • 4.2 Alphabetical Signals Reference

    70
    • Table 26. Signal Description (Sheet 1 of 9)

      70
• 5 Thermal Specifications and Design Considerations

  79
  • 5.1 Processor Thermal Specifications

    79
    • 5.1.1 Thermal Specifications

      79
      • Table 27. Processor Thermal Specifications

        80
      • Table 28. Thermal Profile (Intel® Core™2 Duo Desktop Processor E6x50 Sequence and E6540 with 4 MB L2 Cache)

        81
      • Figure 20. Thermal Profile (Intel® Core™2 Duo Desktop Processor E6x50 Sequence and E6540 with 4 MB L2 Cache)

        81
      • Table 29. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 Sequence with 4 MB L2 Cache)

        82
      • Figure 21. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 Sequence with 4 MB L2 Cache)

        82
      • Table 30. Thermal Profile (Intel® Core™2 Duo Desktop Processor E4500 and E4600 with 2 MB L2 Cache)

        83
      • Figure 22. Thermal Profile (Intel® Core™2 Duo Desktop Processor E4500 and E4600 with 2 MB L2 Cache)

        83
      • Table 31. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 and E4000 Sequence with 2 MB L2 Cache)

        84
      • Figure 23. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 and E4000 Sequence with 2 MB L2 Cache)

        84
      • Table 32. Thermal Profile (Intel® Core™2 Extreme Processor X6800)

        85
      • Figure 24. Thermal Profile (Intel® Core™2 Extreme Processor X6800)

        85
    • 5.1.2 Thermal Metrology

      86
      • Figure 25. Case Temperature (TC) Measurement Location

        86
  • 5.2 Processor Thermal Features

    86
    • 5.2.1 Thermal Monitor

      86
    • 5.2.2 Thermal Monitor 2

      87
      • Figure 26. Thermal Monitor 2 Frequency and Voltage Ordering

        88
    • 5.2.3 On-Demand Mode

      88
    • 5.2.4 PROCHOT# Signal

      89
    • 5.2.5 THERMTRIP# Signal

      89
  • 5.3 Thermal Diode

    90
    • Table 33. Thermal “Diode” Parameters using Diode Model

      90
    • Table 34. Thermal “Diode” Parameters using Transistor Model

      91
    • Table 35. Thermal Diode Interface

      91
  • 5.4 Platform Environment Control Interface (PECI)

    92
    • 5.4.1 Introduction

      92
      • Figure 27. Processor PECI Topology

        92
      • 5.4.1.1 Key Difference with Legacy Diode-Based Thermal Management

        92
        • Figure 28. Conceptual Fan Control on PECI-Based Platforms

          93
        • Figure 29. Conceptual Fan Control on Thermal Diode-Based Platforms

          93
    • 5.4.2 PECI Specifications

      94
      • 5.4.2.1 PECI Device Address

        94
      • 5.4.2.2 PECI Command Support

        94
      • 5.4.2.3 PECI Fault Handling Requirements

        94
      • 5.4.2.4 PECI GetTemp0() Error Code Support

        94
        • Table 36. GetTemp0() Error Codes

          94
• 6 Features

  95
  • 6.1 Power-On Configuration Options

    95
    • Table 37. Power-On Configuration Option Signals

      95
  • 6.2 Clock Control and Low Power States

    95
    • Figure 30. Processor Low Power State Machine

      96
    • 6.2.1 Normal State

      96
    • 6.2.2 HALT and Extended HALT Powerdown States

      96
      • 6.2.2.1 HALT Powerdown State

        96
      • 6.2.2.2 Extended HALT Powerdown State

        97
    • 6.2.3 Stop Grant and Extended Stop Grant States

      97
      • 6.2.3.1 Stop Grant State

        97
      • 6.2.3.2 Extended Stop Grant State

        98
    • 6.2.4 Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State

      98
      • 6.2.4.1 HALT Snoop State, Stop Grant Snoop State

        98
      • 6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State

        98
  • 6.3 Enhanced Intel® SpeedStep® Technology

    98
• 7 Boxed Processor Specifications

  101
  • Figure 31. Mechanical Representation of the Boxed Processor

    101
  • 7.1 Mechanical Specifications

    102
    • 7.1.1 Boxed Processor Cooling Solution Dimensions

      102
      • Figure 32. Space Requirements for the Boxed Processor (Side View)

        102
      • Figure 33. Space Requirements for the Boxed Processor (Top View)

        102
      • Figure 34. Space Requirements for the Boxed Processor (Overall View)

        103
    • 7.1.2 Boxed Processor Fan Heatsink Weight

      103
    • 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      103
  • 7.2 Electrical Requirements

    103
    • 7.2.1 Fan Heatsink Power Supply

      103
      • Figure 35. Boxed Processor Fan Heatsink Power Cable Connector Description

        104
      • Table 38. Fan Heatsink Power and Signal Specifications

        104
      • Figure 36. Baseboard Power Header Placement Relative to Processor Socket

        105
  • 7.3 Thermal Specifications

    105
    • 7.3.1 Boxed Processor Cooling Requirements

      105
      • Figure 37. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)

        106
      • Figure 38. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)

        106
    • 7.3.2 Fan Speed Control Operation (Intel® Core2 Extreme Processor X6800 Only)

      107
    • 7.3.3 Fan Speed Control Operation (Intel® Core2 Duo Desktop Processor E6000 and E4000 Sequences Only)

      107
      • Figure 39. Boxed Processor Fan Heatsink Set Points

        108
      • Table 39. Fan Heatsink Power and Signal Specifications

        108
• 8 Balanced Technology Extended (BTX) Boxed Processor Specifications

  111
  • Figure 40. Mechanical Representation of the Boxed Processor with a Type I TMA

    111
  • Figure 41. Mechanical Representation of the Boxed Processor with a Type II TMA

    112
  • 8.1 Mechanical Specifications

    112
    • 8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor Cooling Solution Dimensions

      112
      • Figure 42. Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes

        113
      • Figure 43. Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume

        114
    • 8.1.2 Boxed Processor Thermal Module Assembly Weight

      114
    • 8.1.3 Boxed Processor Support and Retention Module (SRM)

      115
      • Figure 44. Assembly Stack Including the Support and Retention Module

        115
  • 8.2 Electrical Requirements

    116
    • 8.2.1 Thermal Module Assembly Power Supply

      116
      • Figure 45. Boxed Processor TMA Power Cable Connector Description

        116
      • Table 40. TMA Power and Signal Specifications

        117
      • Figure 46. Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area)

        117
  • 8.3 Thermal Specifications

    118
    • 8.3.1 Boxed Processor Cooling Requirements

      118
    • 8.3.2 Variable Speed Fan

      118
      • Figure 47. Boxed Processor TMA Set Points

        119
      • Table 41. TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed Processors

        119
• 9 Debug Tools Specifications

  121
  • 9.1 Logic Analyzer Interface (LAI)

    121
    • 9.1.1 Mechanical Considerations

      121
    • 9.1.2 Electrical Considerations

      121