Fujitsu FR81S User Manual
CHAPTER 2: HANDLING THE DEVICE
1. Handling Precautions
FUJITSU SEMICONDUCTOR LIMITED
CHAPTER : HANDLING THE DEVICE
FUJITSU SEMICONDUCTOR CONFIDENTIAL
5
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions
will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed
moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent,
do the following:
(1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product.
Store products in locations where temperature changes are slight.
(2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at
temperatures between 5 °C and 30 °C. When you open Dry Package that recommends humidity 40% to
70% RH.
(3) When necessary, FUJITSU SEMICONDUCTOR packages semiconductor devices in highly
moisture-resistant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their
aluminum laminate bags for storage.
(4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
Baking
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the FUJITSU
recommended conditions for baking.
Condition: 125°C /24 h
Static Electricity
Because semiconductor devices are particularly susceptible to damage by static electricity, you must take
the following precautions:
(1)Maintain relative humidity in the working environment between 40% and 70%.Use of an apparatus for
ion generation may be needed to remove electricity.
(2)Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
(3)Eliminate static body electricity by the use of rings or bracelets connected to ground through high
resistance (on the level of 1MΩ). Wearing of conductive clothing and shoes, use of conductive floor
mats and other measures to minimize shock loads is recommended.
(4)Ground all fixtures and instruments, or protect with anti-static measures.
(5)Avoid the use of styrofoam or other highly static-prone materials for storage of completed board
assemblies.
Precautions for Use Environment
Reliability of semiconductor devices depends on ambient temperature and other conditions as described
above.
For reliable performance, do the following:
(1)Humidity
Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high
humidity levels are anticipated, consider anti-humidity processing
(2)Discharge of Static Electricity
When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal
operation.
In such cases, use anti-static measures or processing to prevent discharges.
(3)Corrosive Gases, Dust, or Oil
Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will
adversely affect the device. If you use devices in such conditions, consider ways to prevent such
exposure or to protect the devices.
(4)Radiation, Including Cosmic Radiation
Most devices are not designed for environments involving exposure to radiation or cosmic radiation.
Users should provide shielding as appropriate.
(5)Smoke, Flame
CAUTION: Plastic molded devices are flammable, and therefore should not be use near combustible
substances. If devices begin to smoke or burn, there is danger of the release of toxic gases.
Customers considering the use of FUJITSU SEMICONDUCTOR products in other special
environmental conditions should consult with sales representatives.
MB91520 Series
MN705-00010-1v0-E
90