Fujitsu FR81S User Manual
CHAPTER 1: OVERVIEW
8. Device Package
FUJITSU SEMICONDUCTOR LIMITED
CHAPTER : OVERVIEW
FUJITSU SEMICONDUCTOR CONFIDENTIAL
45
Figure 8-7 LQFP-176(FPT-176P-M07) External Dimensions
176-pin plastic LQFP
Lead pitch
0.50 mm
Package width ×
package length
24.0 × 24.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Code
(Reference)
P-LQFP-0176-2424-0.50
176-pin plastic LQFP
(FPT-176P-M07)
(FPT-176P-M07)
C
2004-2010 FUJITSU SEMICONDUCTOR LIMITED F176013S-c-1-3
Details of "A" part
0°~8°
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.25(.010)
(Stand off)
(.004±.004)
0.10±0.10
1.50
+0.20
–0.10
+.008
+.008
–.004
.059
(Mounting height)
0.08(.003)
(.006±.002)
0.145±0.055
"A"
INDEX
1
LEAD No.
44
45
88
89
132
133
176
0.50(.020)
0.22±0.05
(.009±.002)
M
0.08(.003)
*24.00±0.10(.945±.004)SQ
26.00±0.20(1.024±.008)SQ
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Note 1) * : Values do not include resin protrusion.
Resin protrusion is +0.25(.010)Max(each side).
Note 2) Pins width and pins thickness include plating thickness
Note 3) Pins width do not include tie bar cutting remainder.
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
MB91520 Series
MN705-00010-1v0-E
44