Intel J1850 FH8065301455200 User Manual

Product codes
FH8065301455200
Page of 1272
Power Management
72
Datasheet
6.4.2.3
Dynamic Power Down Operation
Dynamic power-down of memory is employed during normal operation. Based on idle 
conditions, a given memory rank may be powered down. The IMC implements 
aggressive CKE control to dynamically put the DRAM devices in a power-down state. 
The processor core controller can be configured to put the devices in active power-
down (CKE deassertion with open pages) or precharge power-down (CKE deassertion 
with all pages closed). Precharge power-down provides greater power savings but has 
a bigger performance impact, since all pages will first be closed before putting the 
devices in power down mode.
If dynamic power-down is enabled, all ranks are powered up before doing a refresh 
cycle and all ranks are powered down at the end of refresh.
6.4.2.4
DRAM I/O Power Management
Unused signals should be disabled to save power and reduce electromagnetic 
interference. This includes all signals associated with an unused memory channel. 
Clocks can be controlled on a per SO-DIMM basis. Exceptions are made for per SO-
DIMM control signals such as CS#, CKE, and ODT for unpopulated SO-DIMM slots.
The I/O buffer for an unused signal should be tri-stated (output driver disabled), the 
input receiver (differential sense-amp) should be disabled, and any DLL circuitry 
related ONLY to unused signals should be disabled. The input path must be gated to 
prevent spurious results due to noise on the unused signals (typically handled 
automatically when input receiver is disabled).
6.5
PCI Express* (PCIe*) Power Management
Active power management support using L0s, and L1 states.
All inputs and outputs disabled in L3 Ready state.
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