Intel J1850 FH8065301455200 User Manual
Product codes
FH8065301455200
Datasheet
73
Thermal Management
7
Thermal Management
7.1
Overview
The processor’s thermal management system helps in managing the overall thermal
profile of the system to prevent overheating and system breakdown. The architecture
implements various proven methods of maintaining maximum performance while
remaining within the thermal spec. Throttling mechanisms are used to reduce power
consumption when thermal limits of the device are exceeded and the system is notified
of critical conditions using interrupts or thermal signalling pins. Processor thermal
management differs from legacy implementations primarily by replacing dedicated
thermal management hardware with firmware.
profile of the system to prevent overheating and system breakdown. The architecture
implements various proven methods of maintaining maximum performance while
remaining within the thermal spec. Throttling mechanisms are used to reduce power
consumption when thermal limits of the device are exceeded and the system is notified
of critical conditions using interrupts or thermal signalling pins. Processor thermal
management differs from legacy implementations primarily by replacing dedicated
thermal management hardware with firmware.
The thermal management features are:
•
Five digital thermal sensors (DTS)
•
Supports a hardware trip point and four programmable trip points based on the
temperature indicated by thermal sensors.
temperature indicated by thermal sensors.
•
Supports different thermal throttling mechanisms.
7.2
Thermal Design Power (TDP)
The processor TDP is the maximum sustained power that should be used for design of
the processor thermal solution. TDP represents an expected maximum sustained power
from realistic applications. TDP may be exceeded for short periods of time or if running
a “power virus” workload. The processor integrates multiple processing and graphics
cores. This may result in differences in the power distribution across the die and must
be considered when designing the thermal solution.
the processor thermal solution. TDP represents an expected maximum sustained power
from realistic applications. TDP may be exceeded for short periods of time or if running
a “power virus” workload. The processor integrates multiple processing and graphics
cores. This may result in differences in the power distribution across the die and must
be considered when designing the thermal solution.
Intel Graphics Dynamic Frequency Technology has the ability of the processor graphics
cores to opportunistically increase frequency and/or voltage above the guaranteed
graphics frequency for the given part. It is invoked opportunistically and automatically
as long as the processor is conforming to its temperature, power delivery, and current
specification limits. When Intel Graphics Dynamic Frequency Technology is enabled:
cores to opportunistically increase frequency and/or voltage above the guaranteed
graphics frequency for the given part. It is invoked opportunistically and automatically
as long as the processor is conforming to its temperature, power delivery, and current
specification limits. When Intel Graphics Dynamic Frequency Technology is enabled:
•
Applications are expected to run closer to TDP more often as the processor will
attempt to maximize performance by taking advantage of available TDP headroom
in the processor package.
attempt to maximize performance by taking advantage of available TDP headroom
in the processor package.
•
The processor may exceed the TDP for short durations to use any available thermal
capacitance within the thermal solution. The duration and time of such operation
can be limited by platform runtime configurable registers within the processor.
capacitance within the thermal solution. The duration and time of such operation
can be limited by platform runtime configurable registers within the processor.
•
Thermal solutions and platform cooling that are designed to less than thermal
design guidance may experience thermal and performance issues since more
applications will tend to run at or near TDP for significant periods of time.
design guidance may experience thermal and performance issues since more
applications will tend to run at or near TDP for significant periods of time.