STMicroelectronics M93C66-WMN6P Memory IC M93C66-WMN6P Data Sheet

DocID4997 Rev 15

32

Stressing the device outside the ratings listed in the Absolute maximum ratings table may 
cause permanent damage to the device. These are stress ratings only, and operation of the 
device at these, or any other conditions outside those indicated in the operating sections of 
this specification, is not implied. Exposure to absolute maximum rating conditions for 
extended periods may affect device reliability.

          

Ambient operating temperature

–40

130

°C

T

STG

Storage temperature

–65

150

°C

T

LEAD

Lead temperature during soldering

PDIP

-

260

(1)

1. T

LEAD 

max must not be applied for more than 10 s. 

°C

other packages

See note 

(2)

2. Compliant with JEDEC standard J-STD-020D (for small-body, Sn-Pb or Pb assembly), the ST ECOPACK® 

7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS 

directive 2011/65/EU of July 2011).

V

OUT

Output range (Q = V

OH

 or Hi-Z)

–0.50

V

CC

+0.5

V

V

IN

Input range

–0.50

V

CC

+1

V

V

CC

Supply voltage

–0.50

6.5

V

V

ESD

Electrostatic discharge voltage (human body model)

(3)

3. Positive and negative pulses applied on pin pairs, according to the AEC-Q100-002 (compliant with JEDEC 

Std JESD22-A114, C1 = 100 pF, R1 = 1500 

, R2 = 500 ).

-

4000

V