Data Sheet (HH80557RG041512)Table of ContentsContents3Figures5Tables5Revision History7Intel® Celeron® Processor 400 Series Features8Intel® Celeron® Processor 400D Series11 Introduction91.1 Terminology91.1.1 Processor Packaging Terminology101.2 References112 Electrical Specifications132.1 Power and Ground Lands132.2 Decoupling Guidelines132.2.1 Vcc Decoupling132.2.2 Vtt Decoupling132.2.3 FSB Decoupling142.3 Voltage Identification142.4 Market Segment Identification (MSID)162.5 Reserved, Unused and TESTHI Signals162.6 Voltage and Current Specification172.6.1 Absolute Maximum and Minimum Ratings172.6.2 DC Voltage and Current Specification192.6.3 Vcc Overshoot212.6.4 Die Voltage Validation222.7 Signaling Specifications222.7.1 FSB Signal Groups232.7.2 CMOS and Open Drain Signals252.7.3 Processor DC Specifications252.7.3.1 GTL+ Front Side Bus Specifications272.8 Clock Specifications282.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking282.8.2 FSB Frequency Select Signals (BSEL[2:0])292.8.3 Phase Lock Loop (PLL) and Filter292.8.4 BCLK[1:0] Specifications (CK505 based Platforms)302.8.5 BCLK[1:0] Specifications (CK410 based Platforms)322.9 PECI DC Specifications343 Package Mechanical Specifications353.1 Package Mechanical Drawing353.2 Processor Component Keep-Out Zones393.3 Package Loading Specifications393.4 Package Handling Guidelines393.5 Package Insertion Specifications403.6 Processor Mass Specification403.7 Processor Materials403.8 Processor Markings403.9 Processor Land Coordinates414 Land Listing and Signal Descriptions434.1 Processor Land Assignments434.2 Alphabetical Signals Reference665 Thermal Specifications and Design Considerations755.1 Processor Thermal Specifications755.1.1 Thermal Specifications755.1.2 Thermal Metrology785.2 Processor Thermal Features785.2.1 Thermal Monitor785.2.2 Thermal Monitor 2795.2.3 On-Demand Mode805.2.4 PROCHOT# Signal815.2.5 THERMTRIP# Signal815.3 Thermal Diode825.4 Platform Environment Control Interface (PECI)845.4.1 Introduction845.4.1.1 Key Difference with Legacy Diode-Based Thermal Management845.4.2 PECI Specifications865.4.2.1 PECI Device Address865.4.2.2 PECI Command Support865.4.2.3 PECI Fault Handling Requirements865.4.2.4 PECI GetTemp0() Error Code Support866 Features876.1 Power-On Configuration Options876.2 Clock Control and Low Power States876.2.1 Normal State886.2.2 HALT and Extended HALT Powerdown States886.2.2.1 HALT Powerdown State886.2.2.2 Extended HALT Powerdown State896.2.3 Stop Grant State896.2.4 HALT Snoop State and Stop Grant Snoop State907 Boxed Processor Specifications917.1 Mechanical Specifications927.1.1 Boxed Processor Cooling Solution Dimensions927.1.2 Boxed Processor Fan Heatsink Weight947.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly947.2 Electrical Requirements947.2.1 Fan Heatsink Power Supply947.3 Thermal Specifications957.3.1 Boxed Processor Cooling Requirements957.3.2 Variable Speed Fan978 Debug Tools Specifications998.1 Logic Analyzer Interface (LAI)998.1.1 Mechanical Considerations998.1.2 Electrical Considerations99Size: 1.31 MBPages: 100Language: EnglishOpen manual