User Manual (HH80553PG0964MN)Table of ContentsContents Contents3Figures5Tables6Revision History Revision History7Intel® Pentium® D Processor 900 Sequence and Intel® Pentium® Processor Extreme Edition 955, 965 Features9Intel® Pentium® D Processor 900D Sequence and Intel® Pentium® Processor Extreme Edition 955D, 965D11 Introduction111.1 Terminology121.1.1 Processor Packaging Terminology121.2 References13Table 1. References132 Electrical Specifications152.1 Power and Ground Lands152.2 Decoupling Guidelines152.2.1 VCC Decoupling152.2.2 VTT Decoupling152.2.3 FSB Decoupling162.3 Voltage Identification16Table 2. Voltage Identification Definition172.4 Reserved, Unused, and TESTHI Signals182.5 Voltage and Current Specification192.5.1 Absolute Maximum and Minimum Ratings19Table 3. Absolute Maximum and Minimum Ratings192.5.2 DC Voltage and Current Specification20Table 4. Voltage and Current Specifications20Table 5. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A (Mainstream) and 775_VR_CONFIG_05B (Performance) Processors23Figure 1. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A (Mainstream) and 775_VR_CONFIG_05B (Performance) Processors242.5.3 VCC Overshoot24Table 6. VCC Overshoot Specifications1,224Figure 2. VCC Overshoot Example Waveform252.5.4 Die Voltage Validation252.6 Signaling Specifications252.6.1 FSB Signal Groups26Table 7. FSB Signal Groups (Sheet 2 of 2)26Table 8. Signal Characteristics27Table 9. Signal Reference Voltages272.6.2 GTL+ Asynchronous Signals282.6.3 Processor DC Specifications28Table 10. GTL+ Signal Group DC Specifications28Table 11. GTL+ Asynchronous Signal Group DC Specifications29Table 12. TAP Signal Group DC Specifications29Table 13. VTTPWRGD DC Specifications30Table 14. BSEL[2:0] and VID[5:0] DC Specifications30Table 15. MSID [1,0] and BOOTSELECT DC Specifications302.6.3.1 GTL+ Front Side Bus Specifications31Table 16. GTL+ Bus Voltage Definitions312.7 Clock Specifications322.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking32Table 17. Core Frequency to FSB Multiplier Configuration322.7.2 FSB Frequency Select Signals (BSEL[2:0])32Table 18. BSEL[2:0] Frequency Table for BCLK[1:0]332.7.3 Phase Lock Loop (PLL) and Filter33Figure 3. Phase Lock Loop (PLL) Filter Requirements342.7.4 BCLK[1:0] Specifications35Table 19. Front Side Bus Differential BCLK Specifications353 Package Mechanical Specifications37Figure 4. Processor Package Assembly Sketch373.1 Package Mechanical Drawing37Figure 5. Processor Package Drawing Sheet 1 of 338Figure 6. Processor Package Drawing Sheet 2 of 339Figure 7. Processor Package Drawing Sheet 3 of 3403.2 Processor Component Keep-Out Zones413.3 Package Loading Specifications41Table 20. Processor Loading Specifications413.4 Package Handling Guidelines41Table 21. Package Handling Guidelines413.5 Package Insertion Specifications413.6 Processor Mass Specification423.7 Processor Materials42Table 22. Processor Materials423.8 Processor Markings42Figure 8. Processor Top-Side Markings Example (Intel® Pentium® D Processor 900 Sequence)42Figure 9. Processor Top-Side Markings Example (Intel® Pentium® Processor Extreme Edition 955, 965)433.9 Processor Land Coordinates43Figure 10. Processor Land Coordinates and Quadrants (Top View)444 Land Listing and Signal Descriptions454.1 Processor Land Assignments45Figure 11. land-out Diagram (Top View - Left Side)46Figure 12. land-out Diagram (Top View - Right Side)47Table 23. Alphabetical Land Assignments48Table 24. Numerical Land Assignment594.2 Alphabetical Signals Reference70Table 25. Signal Description (Sheet 1 of 9)705 Thermal Specifications and Design Considerations815.1 Processor Thermal Specifications815.1.1 Thermal Specifications81Table 26. Processor Thermal Specifications82Table 27. Thermal Profile for 775_VR_CONFIG_05B Processors (Performance)83Figure 13. Thermal Profile for 775_VR_CONFIG_05B Processors (Performance)83Table 28. Thermal Profile for 775_VR_CONFIG_05A Processors (Mainstream)84Figure 14. Thermal Profile for 775_VR_CONFIG_05A Processors (Mainstream)845.1.2 Thermal Metrology85Figure 15. Case Temperature (TC) Measurement Location855.2 Processor Thermal Features855.2.1 Thermal Monitor855.2.2 On-Demand Mode865.2.3 PROCHOT# Signal865.2.4 FORCEPR# Signal875.2.5 THERMTRIP# Signal885.2.6 TCONTROL and Fan Speed Reduction885.2.7 Thermal Diode88Table 29. Thermal “Diode” Parameters using Diode Model88Table 30. Thermal “Diode” Parameters using Transistor Model89Table 31. Thermal “Diode” ntrim and Diode_Correction_Offset90Table 32. Thermal Diode Interface906 Features916.1 Power-On Configuration Options91Table 33. Power-On Configuration Option Signals916.2 Clock Control and Low Power States91Figure 16. Processor Low Power State Machine926.2.1 Normal State926.2.2 HALT and Enhanced HALT Powerdown States926.2.2.1 HALT Powerdown State926.2.2.2 Enhanced HALT Powerdown State936.2.3 Stop Grant State936.2.4 Enhanced HALT Snoop or HALT Snoop State, Stop Grant Snoop State946.2.4.1 HALT Snoop State, Stop Grant Snoop State946.2.4.2 Enhanced HALT Snoop State946.2.5 Enhanced Intel® SpeedStep® Technology947 Boxed Processor Specifications95Figure 17. Mechanical Representation of the Boxed Processor957.1 Mechanical Specifications957.1.1 Boxed Processor Cooling Solution Dimensions95Figure 18. Space Requirements for the Boxed Processor (Side View: applies to all four side views)96Figure 19. Space Requirements for the Boxed Processor (Top View)96Figure 20. Space Requirements for the Boxed Processor (Overall View)977.1.2 Boxed Processor Fan Heatsink Weight977.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly977.2 Electrical Requirements977.2.1 Fan Heatsink Power Supply97Figure 21. Boxed Processor Fan Heatsink Power Cable Connector Description98Table 34. Fan Heatsink Power and Signal Specifications98Figure 22. Baseboard Power Header Placement Relative to Processor Socket997.3 Thermal Specifications997.3.1 Boxed Processor Cooling Requirements99Figure 23. Boxed Processor Fan Heatsink Airspace Keep-out Requirements (Side 1 View)100Figure 24. Boxed Processor Fan Heatsink Airspace Keep-out Requirements (Side 2 View)1008 Balanced Technology Extended (BTX) Boxed Processor Specifications101Figure 25. Mechanical Representation of the Boxed Processor with a Type I TMA101Figure 26. Mechanical Representation of the Boxed Processor with a Type II TMA1028.1 Mechanical Specifications1028.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor Cooling Solution Dimensions102Figure 27. Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes103Figure 28. Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume1048.1.2 Boxed Processor Thermal Module Assembly Weight1048.1.3 Boxed Processor Support and Retention Module (SRM)104Figure 29. Assembly Stack Including the Support and Retention Module1058.2 Electrical Requirements1058.2.1 Thermal Module Assembly Power Supply105Figure 30. Boxed Processor TMA Power Cable Connector Description106Table 35. TMA Power and Signal Specifications106Figure 31. Balanced Technology Extended (BTX) Mainboard Power Header Placement (Hatched Area)1078.3 Thermal Specifications1078.3.1 Boxed Processor Cooling Requirements1078.3.2 Variable Speed Fan108Figure 32. Boxed Processor TMA Set Points108Table 36. TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed Processors1099 Debug Tools Specifications1119.1 Logic Analyzer Interface (LAI)1119.1.1 Mechanical Considerations1119.1.2 Electrical Considerations111Size: 2.51 MBPages: 112Language: EnglishOpen manual